Category:Integrated Circuits (ICs)
Embedded
System On Chip (SoC)
Product Status:Active
Peripherals:DDR, DMA, PCIe
Primary Attributes:Versal™ AI Core FPGA, 1M Logic Cells
Series:Versal™ AI Core
Package:Tray
Mfr:AMD
Supplier Device Package:1369-BGA (35x35)
Connectivity:CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature:-40°C ~ 100°C (TJ)
Architecture:MPU, FPGA
Package / Case:1369-BFBGA
Number Of I/O:500
RAM Size:-
Speed:400MHz, 1GHz
Core Processor:Dual ARM® Cortex®-A72 MPCore™ With CoreSight™, Dual ARM®Cortex™-R5F With CoreSight™
Flash Size:-
Basic Infomation
Payment & Shipping Terms
Stock:In Stock
Shipping Method:LCL, AIR, FCL, Express
Description:IC VERSAL AI-EDGE FPGA 1369BGA
Payment Terms:L/C, D/A, D/P, T/T, Western Union, MoneyGram
Gallery
XCVE1752-1LLINSVG1369
Product Description
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ AI Core Versal™ AI Core FPGA, 1M Logic Cells 400MHz, 1GHz 1369-BGA (35x35)
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